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  low capacitance , low charge injection, 15 v/+12 v i cmos quad spst switches data sheet adg1211 / adg1212 / adg1213 rev. b information furnished by analog devices is believed to be accurate and reliable. however, no responsibility is assumed by analog devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. specifications subject to change without notice. no license is granted by implication o r otherwise under any patent or patent rights of analog devices. trademarks and registered trademarks are the property of their respective owners. one technology way, p.o. box 9106, norwood, ma 02062 - 9106, u.s.a. tel: 781.329.4700 www.analog.com fax: 781.461.3113 ? 2005 C 2012 analog devices, inc. all rights reserved. features 1 pf o ff capacita nce 2.6 pf o n capacitance <1 pc charge injec tion 33 v supply ran ge 120 ? o n resi stance fully s pecified at 15 v, +12 v no v l s upply required 3 v logic - compatible inpu ts rail -to- rail oper ation 16 -l ead tssop and 16 - lead lfcsp typic al power consumption: <0.03 w applications automatic test equip ment data acquisition s ystems battery- powered syst ems sample- and - hold sy stems audio signal rou ting video signal routing communication s ystems general description the adg12 11/adg1212/ adg1213 are monolithic complemen - tary metal - oxide semiconductor ( cmos) devices containing four independently selectable switches designed on an i cmos? (industrial cmos) process. i cmos is a modular manufacturing process combining high voltage cmos and bipolar techn ologies. it enables the development of a wide range of high performance analog ics capable of 3 3 v operation in a footprint that no previous generation of high voltage parts has been able to achieve. unlike analog ics using conventional cmos processes, i cmos components can tolerate high supply voltages while providing increased performance, dramatically lower power consumption, and reduced package size. the ultralow capacitance and charge injection of these switches make them ideal solutions for data acquis ition and sample - and - hold applications, where low glitch and fast settling are required. fast switching speed coupled with high signal bandwidth make the parts suitable for video signal switching. functional block diagram in1 in2 in3 in4 s1 d1 s2 d2 s3 d3 s4 d4 adg1211 switches shown for a logic 1 input in1 in2 in3 in4 s1 d1 s2 d2 s3 d3 s4 d4 adg1212 in1 in2 in3 in4 s1 d1 s2 d2 s3 d3 s4 d4 adg1213 04778-001 figure 1. i cmos construction ensures ultralow power dissipation , making the parts ideally suited for portable and battery - powered instruments. the adg1211/adg1212/adg1213 contain four independent single-pole/single- throw (spst) switches. the adg1211 and adg121 2 differ only in that the digital control logic is inverted. the adg1211 switches are turned on with logic 0 on the app ropriate control input, while logic 1 is required for the adg1212. the adg1213 has two switches with digital control logic similar to tha t of the adg1211 ; the logic is inverted on the other two switches. the adg1213 exhibits break - before - make switching action for use in multiplexer applications. each switch conducts equally well in both directions when on and has an input signal range that extends to the supplies. in the off condition, signal levels up to the supplies are blocked. product highlights 1. ultra low cap acitance. 2. <1 pc charge inject ion . 3. 3 v logic - compatible digital inp uts : v ih = 2.0 v, v il = 0.8 v. 4. no v l logic power supply require d. 5. ultralow power dissipatio n: <0.03 w. 6. 16 -l ead tssop and 3 mm 3 mm lfcsp p ackage s.
adg1211/adg1212/adg1213 data sheet rev. b | page 2 of 16 table of contents specifications ..................................................................................... 3 dual supp ly ................................................................................... 3 single supply ................................................................................. 5 absolute maximum ratings ............................................................ 6 esd caution .................................................................................. 6 pin configurations and function descriptions ........................... 7 terminology .......................................................................................8 typic al performance characteristics ..............................................9 test circuits ..................................................................................... 12 outline dimensions ....................................................................... 14 ordering guide .......................................................................... 15 revision history 8/12 rev. a to rev. b changes to table 1 ............................................................................ 3 changes to table 2 ............................................................................ 5 change to table 6 ............................................................................. 7 updated outline dimensions ....................................................... 14 changes to ordering guide .......................................................... 15 2/0 9 rev . 0 to rev. a changes to p ower requirements, i dd , digital inputs = 5 v parameter, table 1 ............................................................................. 4 changes to power requirements, i dd , digital inputs = 5 v parameter, table 2 ............................................................................. 5 7/0 5 revision 0: initial versi on
data sheet adg1211/adg1212/adg1213 rev. b | page 3 of 16 specifications dual supply v dd = 15 v 10%, v ss = ? 15 v 10% , gn d = 0 v, unless otherwise noted. table 1. y version 1 parameter 25c ?40c to +85c ?40c to +125c unit test conditions/comments analog switch analog signal range v dd to v ss v on resistance (r on ) 120 ? typ v s = 10 v, i s = ?1 ma; see figure 20 190 230 260 ? max v dd = +13.5 v, v ss = ?13.5 v on resistance match between channels ( ?r on ) 2.5 ? typ v s = 10 v , i s = ?1 ma 6 10 11 ? max on resistance flatness (r flat( on) ) 20 ? typ v s = ?5 v/0 v/+5 v; i s = ?1 ma 57 72 79 ? max leakage currents v dd = +16.5 v, v ss = ?16.5 v source off leakage, i s (off) 0.02 na typ v s = 10 v, v d = ? 10 v; see figure 21 0.1 0.6 1 na max drain off leakage, i d (off) 0.02 na typ v s = 10 v, v d = ? 10 v; see figure 21 0.1 0.6 1 na max channel on leakage, i d , i s (on) 0.02 na typ v s = v d = 10 v; see figure 22 0.1 0.6 1 na max digital inputs input high voltage, v inh 2.0 v min input low voltage, v inl 0.8 v max input current, i inl or i inh 0.005 a typ v in = v inl or v inh 0.1 a max digital input capacitance, c in 2.5 pf typ dynamic characteristics 2 t on 1 10 ns typ r l = 300 ?, c l = 35 pf 130 160 195 ns max v s = 10 v; see figure 23 t off 85 ns typ r l = 300 ?, c l = 35 pf 115 130 150 ns max v s = 10 v; see figure 23 break - before -ma ke time delay, t d 25 ns typ r l = 300 ?, c l = 35 pf (adg1213 o nly) 10 ns min v s1 = v s2 = 10 v ; see figure 24 charge injection ?0.3 pc typ v s = 0 v, r s = 0 ?, c l = 1 nf; see figure 25 off isolation 80 db typ r l = 50 ?, c l = 5 pf, f = 1 mhz; see figure 26 channel -to - channel crosstalk 90 db typ r l = 50 ? , c l = 5 pf, f = 1 mhz; see figure 27 total harmonic distortion + noise 0.15 % typ r l = 10 k?, 5 v rms, f = 20 hz to 20 khz ?3 db bandwidth 1000 mhz typ r l = 50 ?, c l = 5 pf; see figure 28 c s (off) 0.9 pf typ v s = 0 v, f = 1 mhz 1.1 pf max v s = 0 v, f = 1 mhz c d (off) 1 pf typ v s = 0 v, f = 1 mhz 1.2 pf max v s = 0 v, f = 1 mhz c d , c s (on) 2.6 pf typ v s = 0 v, f = 1 mhz 3 pf max v s = 0 v, f = 1 mhz
adg1211/adg1212/adg1213 data sheet rev. b | page 4 of 16 y version 1 parameter 25c ?40c to +85c ?40c to +125c unit test conditions/comments power requirements v dd = +16.5 v, v ss = ?16.5 v i dd 0.001 a typ digital inputs = 0 v or v dd 1.0 a max i dd 220 a typ digital inputs = 5 v 380 a max i ss 0.001 a typ digital inputs = 0 v or v dd 1.0 a max i ss 0.001 a typ digital inputs = 5 v 1.0 a max vdd/vss 4.5/16.5 v min/max 1 temperature range for y version is ? 40c to +125c. 2 guaranteed by design, not subject to production test.
data sheet adg1211/adg1212/adg1213 rev. b | page 5 of 16 single supply v dd = 12 v 10%, v ss = 0 v, gn d = 0 v, unless otherwise noted. table 2. y version 1 parameter 25c ?40c to +85c ?40c to +125c unit test conditions/comments analog switch analog signal range 0 v to v dd v on resistance (r on ) 300 ? typ v s = 0 v to 10 v, i s = ?1 ma; see figure 20 475 567 625 ? m ax v dd = 10.8 v, v ss = 0 v on resistance match between channels ( ?r on ) 4.5 ? typ v s = 0 v to 10 v, i s = ?1 ma 12 26 27 ? max on resistance flatness (r flat(on) ) 60 ? typ v s = 3 v/6 v/9 v, i s = ?1 ma leakage currents v dd = 13.2 v, v ss = 0 v source off leakage, i s (off) 0.02 na typ v s = 1 v/10 v, v d = 10 v/1 v; see figure 21 0.1 0.6 1 na max drain off leakage, i d (off) 0.02 na typ v s = 1 v/10 v, v d = 10 v/1 v; see figure 21 0.1 0.6 1 na max channel on leakage, i d , i s (on) 0.02 na typ v s = v d = 1 v or 10 v; see figure 22 0.1 0.6 1 na max digital inputs input high voltage, v inh 2.0 v min input low voltage, v inl 0.8 v max input current, i inl or i inh 0.001 a typ v in = v inl or v inh 0.1 a max digital input capacitance, c in 3 pf typ dynamic characteristics 2 t on 130 ns typ r l = 300 ?, c l = 35 pf 170 210 240 ns max v s = 8 v; see figure 23 t off 95 ns typ r l = 300 ? , c l = 35 pf 120 145 180 ns max v s = 8 v; see figure 23 break - before - make time d elay, t d 50 ns typ r l = 300 ? , c l = 35 pf (adg1213 o nly) 10 ns min v s1 = v s2 = 8 v ; see figure 24 charge injection 0 pc typ v s = 6 v, r s = 0 ? , c l = 1 nf; see figure 25 off isolation 80 db typ r l = 50 ? , c l = 5 pf, f = 1 mhz ; see figure 26 channel -to - channel crosstalk 90 db typ r l = 50 ? , c l = 5 pf, f = 1 mhz ; see figure 27 ?3 db bandwidth 900 mhz typ r l = 50 ? , c l = 5 pf ; see figure 28 c s (off) 1.2 pf typ v s = 6 v, f = 1 mhz 1.4 pf max v s = 6 v, f = 1 mhz c d (off) 1.3 pf typ v s = 6 v, f = 1 mhz 1.5 pf max v s = 6 v, f = 1 mhz c d , c s (on) 3.2 pf typ v s = 6 v, f = 1 mhz 3.9 pf max v s = 6 v, f = 1 mhz power requirements v dd = 13.2 v i dd 0.001 a typ digital inputs = 0 v or v dd 1.0 a max i dd 220 a typ digital inputs = 5 v 1.0 a max vdd 5/165 v min/max v ss = 0 v, gnd = 0 v 1 temperature range for y version is ? 40c to +125c. 2 guaranteed by design, not subject to production test.
adg1211/adg1212/adg1213 data sheet rev. b | page 6 of 16 absolute maximum rat ings t a = 25c, unless otherwise noted. table 3. parameter rating v dd to v ss 35 v v dd to gnd ? 0.3 v to +25 v v ss to gnd +0.3 v to ?25 v analog inputs 1 v ss C 0.3 v to v dd + 0.3 v or 30 ma, whichever occurs first digital inputs 1 gnd C 0.3 v to v dd + 0.3 v or 30 ma, whichever occurs first peak current, s or d 100 ma (pulsed at 1 ms, 10% duty cycle max) continuous current per c hannel , s or d 25 ma operating temperature range automotive (y version) ? 40c to +125c storage temperature range ? 65c to +150c junction temperature 150c 16- lead tssop, ja therma l impedance (4 -l ayer b oard) 112 c/w 16 - lead lfcsp, ja thermal impedance 72.7 c/w reflow soldering peak temperature, pb free 260c 1 overvoltages at in, s , or d are clamped by internal diodes. current should be limited to the maximum ratings given. stresses above those listed under absolute maximum ratings may cause permanent damage to the device. this is a stress r ating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for extended periods may affect device rel iability. only one absolute maximum rating may be applied at any one time. table 4 . adg1211/adg1212 truth table adg1211 inx adg1212 inx switch condition 0 1 on 1 0 o ff table 5 . adg1213 truth tabl e adg1213 inx switch 1, 4 switch 2, 3 0 o ff on 1 on o ff esd caution esd (electrostatic discharge) sensitive device. electrostatic charges as high as 4000 v readily accumulate on the human body and test equipment and can discharge without de tection. although this product features proprietary esd protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. therefore, proper esd precautions are recommended to avoid performance degradation or loss of functionality.
data sheet adg1211/adg1212/adg1213 rev. b | page 7 of 16 pin configurations and function descript io ns top view 1 2 3 4 5 6 7 8 adg1211/ adg1212/ adg1213 nc = no connect 16 15 14 13 12 11 10 9 d1 s1 v ss d4 s4 gnd in1 d2 s2 v dd d3 in4 in3 s3 nc in2 04788-002 figure 2 . tssop pin configuration pin 1 indicator nc = no connect notes 1. exposed pad tied to substrate, v ss . 1s1 2v ss 3gnd 4s4 11 v dd 12 s2 10 nc 9 s3 5d4 6in4 7in3 8d3 15 in1 16 d1 14 in2 13 d2 top view (not to scale) 04778-003 adg1211/adg1212/adg1213 figure 3. lfcsp pin configuration table 6 . pin function descriptions pin no. mnemonic description tssop lfcsp 1 15 in1 logic control input. 2 16 d1 drain terminal. can be an input or output. 3 1 s1 source terminal. c an be an input or output. 4 2 v ss most negative power supply potenti al. 5 3 gnd ground (0 v) refer e nce. 6 4 s4 source terminal. can be an input or output. 7 5 d4 drain terminal. can be an input or output. 8 6 in4 logic control inpu t. 9 7 in3 logic control inp ut. 10 8 d3 drain terminal. can be an input or output. 11 9 s3 source terminal. can be an input or output. 12 10 nc no internal c onnection. 13 11 v dd most positive power supply pote ntial. 14 12 s2 source terminal. can be an input or output. 15 13 d2 drain terminal. can be an input or output. 16 14 in2 logic control inpu t.
adg1211/adg1212/adg1213 data sheet rev. b | page 8 of 16 terminology i dd the positive supply current. i ss the negative supply current. v d (v s ) the analog voltage on terminals d and s. r on the ohmic resistance between d and s. r flat(on) flatness is defined as the difference between the maximum and minimum value of on res istance, as measured over the specified analog signal range. i s (off) the source leakage current with the switch off. i d (off) the drain leakage current with the switch off. i d , i s (on) the channel leakage current with the switch on. v inl the maximum inpu t voltage for logic 0. v inh the minimum input voltage for logic 1. i inl (i inh ) the input current of the digital input. c s (off) the off switch source capacitance, measured with reference to ground. c d (off) the off switch drain capacitance, measured with reference to ground. c d , c s (on) the on switch capacitance, measured with reference to ground. c in the digital input capacitance. t on the delay between applying the digital control input and the output switching on. see figure 23 . t off the delay between applying the digital control input and the output switching off. see figure 23. charge injection a measure of the glitch impulse transferred from the digital in put to the analog output during switching. off isolation a measure of unwanted signal coupling through an off switch. crosstalk a measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. band width the frequency at which the output is attenuated by 3 db. on response the frequency response of the on switch. insertion loss the loss due to the on resistance of the switch. thd + n the ratio of the harmonic amplitude plus noise of the signal to the fundamental.
data sheet adg1211/adg1212/adg1213 rev. b | page 9 of 16 typi cal performance char acteristics v dd = +15v v ss = ?15v v dd = +16.5v v ss = ?16.5v source or drain voltage (v) on resistance (?) 200 180 160 140 120 100 60 80 0 20 40 ?18 ?15 ?12 ?9 ?6 ?3 3 9 15 0 6 12 18 04778-008 v dd = +13.5v v ss = ?13.5v t a = +25c figure 4. on resistance as a function of v d (v s ) for dual supply source or drain voltage (v) on resistance (?) 450 400 350 300 250 150 200 0 50 100 ?5 ?4 ?3 ?2 ?1 2 4 0 1 3 5 04778-004 v dd = +5.5v v ss = ?5.5v t a = +25c figure 5. on resistance as a function of v d (v s ) for dual supply v dd = 13.2v v ss = 0v source or drain voltage (v) on resistance (?) 450 400 350 300 250 150 200 0 50 100 0 2 4 6 8 10 12 04778-005 v dd = 12v v ss = 0v v dd = 10.8v v ss = 0v t a = 25c figure 6. on resistance as a function of v d (v s ) for single supply source or drain voltage (v) on resistance (?) 250 150 200 0 50 100 ?15 ?10 ?5 0 5 10 15 04778-006 v dd = +15v v ss = ?15v t a = +125c t a = +25c t a = +85c t a = ?40 c figure 7 . on resistance as a function of v d (v s ) for different temperatures, dual supply source or drain voltage (v) on resistance (?) 600 400 500 300 200 0 100 0 2 4 6 8 10 12 04778-007 v dd = +12v v ss = 0v t a = +125c t a = +25c t a = +85c t a = ?40 c figure 8 . on resistance as a function of v d (v s ) for different temperatures, single supply temperature (c) leakage (na) 0.20 0.15 0.10 0.05 0 ?0.10 ?0.05 ?0.15 ?0.20 20 0 40 60 80 100 120 04778-012 i s (off) i d (off) i d , i s (on) v dd = +15v v ss = ?15v v bias = +10v/?10v figure 9 . leakage currents as a function of temperature, dual supply
adg1211/adg1212/adg1213 data sheet rev. b | page 10 of 16 temperature (c) leakage (na) 0.30 0.25 0.20 0.15 0.10 0.05 0 ?0.05 ?0.10 20 0 40 60 80 100 120 04778-013 i s (off) i d (off) i d , i s (on) v dd = 12v v ss = 0v v bias = 1v/10v figure 10 . leakage currents as a function of temperature , sing le supply logic, in x (v) i dd (a) 60 50 40 30 10 20 0 0 2 4 6 8 10 12 14 04778-011 v dd = +12v, v ss = 0v v dd = +15v, v ss = ?15v i dd per channel t a = +25c figure 11 . i dd vs. logic level v s (v) charge injection (pc) 6 4 2 0 ?4 ?2 ?6 ?15 ?10 ?5 0 5 10 15 04778-015 v dd = +12v, v ss = 0v v dd = +5v, v ss = ?5v v dd = +15v, v ss = ?15v source to drain drain to source t a = +25c figure 12 . charge injection vs. source voltage temperature (c) time (ns) 200 160 180 140 100 60 20 120 80 40 0 ?40 ?20 40200 60 80 100 120 04778-016 15v ds t off 12v ss t off 15v ds t on 12v ss t on figure 13 . t on /t off times vs. temperature frequency (hz) off isolation (db) 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 ?100 ?110 10k 100k 1m 10m 100m 1g 04778-017 v dd = +15v v ss = ?15v t a = +25c figure 14 . off isolation vs. frequency frequency (hz) crosstalk (db) 0 ?10 ?20 ?30 ?40 ?50 ?60 ?70 ?80 ?90 ?100 ?120 ?110 10k 100k 1m 10m 100m 04778-018 v dd = +15v v ss = ?15v t a = +25c figure 15 . crosstalk vs. frequency
data sheet adg1211/adg1212/adg1213 rev. b | page 11 of 16 frequency (hz) attenuatioin (db) 0 ?10 ?5 ?15 ?25 ?20 ?30 10k 100k 1m 10m 1g 100m 10g 04778-019 v dd = +15v v ss = ?15v t a = +25c figure 16 . on response vs. frequency frequency (hz) thd+n (%) 10.00 1.00 0.10 0.01 10 100 1k 10k 100k 04778-029 load = +10k? t a = +25c v dd = +5v, v ss = ?5v, v s = +3.5vrms v dd = +15v, v ss = ?15v, v s = +5vrms figure 17 . thd + n vs. frequency v bias (v) capacitance (pf) 3.0 2.5 2.0 1.5 1.0 0.5 ?10 ?8 ?6 ?4 ?2 0 2 4 6 8 10 04778-031 v dd = +15v v ss = ?15v t a = +25c source/drain on source off drain off figure 18 . capacitance vs. source voltage , dual supply v bias (v) capacitance (pf) 4.0 3.0 3.5 1.5 2.0 2.5 1.0 0.5 0 0 2 4 6 8 10 12 04778-030 v dd = 12v v ss = 0v t a = 25c source/drain on source off drain off figure 19 . capacitance vs. source voltage , single supply
adg1211/adg1212/adg1213 data sheet rev. b | page 12 of 16 test circuits i ds v1 s d v s r on = v1/i ds 04778-020 s d v s a a v d i s (off) i d (off) 04778-021 s d a v d i d (on) nc nc = no connect 04778-022 figure 20 . on resistance figure 21 . off leakag e figure 22 . on leakage v s in s d gnd r l 300? c l 35pf v out v dd v ss 0.1f v dd 0.1f v ss adg1212 adg1211 v in v in v out t on t off 50% 50% 90% 90% 50% 50% 04778-023 figure 23 . switching times v s2 in1, in2 s2 d2 v s1 s1 d1 gnd r l 300? c l 35pf v out2 v out1 v dd v ss 0.1f v dd 0.1f v ss v in v out1 v out2 adg1213 t d t d 50% 50% 90% 90% 90% 90% 0v 0v 0v r l 300? c l 35pf 04778-024 figure 24. break - before - make time delay in v out adg1212 adg1211 v in v in v out off dv out on q inj = c l d v out s d v dd v ss v dd v ss v s r s gnd c l 1nf 04778-025 figure 25 . charge injection
data sheet adg1211/adg1212/adg1213 rev. b | page 13 of 16 v out 50? network analyzer r l 50? in v in s d 50? off isolation = 20 log v out v s v s v dd v ss 0.1f v dd 0.1f v ss gnd 04778-026 figure 26 . off isolation channel-to-channel crosstalk = 20 log v out gnd s1 d s2 v out network analyzer r l 50? r 50? v s v s v dd v ss 0.1f v dd 0.1f v ss 04778-027 figure 27 . channel - to - channel crosstalk v out 50? network analyzer r l 50? in v in s d insertion loss = 20 log v out with switch v out without switch v s v dd v ss 0.1f v dd 0.1f v ss gnd 04778-028 figure 28 . bandwidth v out r s audio precision r l 10k? in v in s d v s v p-p v dd v ss 0.1f v dd 0.1f v ss gnd 04778-032 figure 29 . thd + noise
adg1211/adg1212/adg1213 data sheet rev. b | page 14 of 16 outline dimensions 16 9 8 1 pin 1 seating plane 8 0 4.50 4.40 4.30 6.40 bsc 5.10 5.00 4.90 0.65 bsc 0.15 0.05 1.20 max 0.20 0.09 0.75 0.60 0.45 0.30 0.19 coplanarity 0.10 compliant to jedec standards mo-153-ab figure 30 . 16 - lead thin shrink small outline package [ tssop] (ru - 16) dimensions shown in m illimeters * compliant to jedec standards mo-220-v eed-2 e xcept for exposed pad dimension. 1 0.50 bsc 0.60 max pin 1 indicator 1.50 ref 0.50 0.40 0.30 0.25 min 0.45 2.75 bsc sq top view 12 max 0.80 max 0.65 typ seating plane pin 1 indicator 0.90 0.85 0.80 0.30 0.2 3 0 .18 0.05 max 0.02 nom 0.20 ref 3.00 bsc sq * 1.65 1.50 sq 1.35 16 5 13 8 9 12 4 exposed pad bottom v iew for proper connection of the expo sed p ad, refer to the pin configuration and functi on d escriptions section of this data sheet. 07-17-2008-a figure 31 . 16 - lead lead frame chip scale package [ lfcsp _vq ] 3 mm 3 mm body , very thin quad (cp - 16 -3) dimensions shown in m illimeters
data sheet adg1211/adg1212/adg1213 rev. b | page 15 of 16 ordering guide model 1 temperature range package description package option branding adg1211yruz ?40c to +125c thin shrink small outline package (tssop) ru -16 adg1211yruz - reel ?40c to +125c thin shrink small outline package (tssop) ru - 16 adg121 1yruz- reel7 ?40c to +125c thin shrink small outline package (tssop) ru -16 adg1211ycpz-500rl7 ?40c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s07 adg1211ycpz- reel7 ? 40c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s07 ADG1212YRUZ ? 40c to +125c thin shrink small outline package (tssop) ru -16 ADG1212YRUZ- reel ? 40c to +125c thin shrink small outline package (tssop) ru -16 ADG1212YRUZ- reel7 ? 40c to +125c thin shrink small outline package (tssop) ru -16 adg121 2ycpz-500rl7 ?4 0c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s08 adg1212ycpz- reel7 ? 40c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s08 adg1213yruz ? 40c to +125c thin shrink small outline package (tssop) ru -16 adg1 213yruz- reel ? 40c to +125c thin shrink small outline package (tssop) ru -16 adg1213yruz - reel7 ? 40c to +125c thin shrink small outline package (tssop) ru - 16 adg1213ycpz-500rl7 ? 40c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s09 adg1213ycpz- reel7 ? 40c to +125c lead frame chip scale package (lfcsp_vq) cp-16-3 s09 1 z = rohs compliant part.
adg1211/adg1212/adg1213 data sheet rev. b | page 16 of 16 notes ? 2005 C 2012 analog devices, inc. all rights reserved. trademarks and registered trademarks are the property of their respective owners. d04778 -0- 8/12(b)


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